Method and apparatus for application of adhesive tape to semiconductor devices

ABSTRACT

A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 09/330,794,filed Jun. 14, 1999, now U.S. Pat. No. 6,267,167 B1, issued Jul. 31,2001, which is a divisional of application Ser. No. 08/908,291, filedAug. 7, 1997, now U.S. Pat. No. 6,096,165, issued Aug. 1, 2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention pertains to semiconductor devices and, more particularly,to a method and apparatus for applying adhesively coated tape materialsegments, i.e., decals, to leadframes for semiconductor devices,particularly including “Lead-Over-Chip” type semiconductor deviceassemblies.

2. State of the Art

In semiconductor manufacture, a single semiconductor die (or chip)typically has a lower surface, the back of the die, being devoid ofcircuitry located thereon. Each semiconductor die also has an oppositeupper surface, the active surface or face of the die, having integratedcircuitry constructed thereon which is electrically accessible via wirebonding pads located thereon. The wire bonding pads may be arranged in avariety of configurations on the active surface of the semiconductordevice, such as along the center of the die, the edges of the die, both,etc.

Typically, a leadframe is used to connect the wire bonding pads of thesemiconductor device via wire bonds to other electronic circuitry.

A conventional leadframe and semiconductor device assembly or packagingprocess employs an adhesive layer to attach the semiconductor device tothe die paddle of the leadframe while the lead fingers of the leadframeextend to and terminate adjacent the peripheral edges of thesemiconductor device. Typically, the adhesive used to attach thesemiconductor device to the die paddle is an epoxy acrylic silicone ofpolyamide material.

Alternately, a lead-over chip, also sometimes referred to as alead-on-chip (LOC) leadframe, is used to provide lead fingers to beelectrically connected to the bond pads of the semiconductor devicethrough wire bonds thereto and to support the semiconductor device bybeing adhesively secured to the active surface thereof and,subsequently, encapsulated. A LOC type semiconductor package isdescribed in U.S. Pat. No. 4,862,245 (Pashby et al.).

Typically, in a LOC semiconductor device assembly, the active surface ofthe semiconductor device is adhesively attached to the underside of thelead fingers of the leadframe through the use of a double-sided,adhesively coated tape having a thermosetting adhesive thereon, althougha thermoplastic adhesive may also be used if desired. That is, theadhesively coated tape has thermosetting adhesive coated on both sidesthereof and is attached to the underside of the leadframe fingers andthe active surface of the semiconductor device using heat and pressure.If necessary, an oven may then be used to further cure the adhesive.After the adhesive is cured, securing the lead fingers in position onthe active surface of the semiconductor device, the leadframe istransferred to a wire bonding machine where the bond wires are connectedto the bond pads on the active surface of the semiconductor device andto the lead fingers of the leadframe.

Prior to attaching the semiconductor device to the leadframe using a LOCconfiguration, the adhesively coated tape must be placed onto a heatedleadframe that will secure the semiconductor device to the leadframe butwill allow access to the bond pads of the semiconductor device.Typically, a single piece of LOC tape is distanced from a continuousroll of tape and cut, using a punch, into two tape segments, i.e.,decals, that are spaced apart and cut away to provide access to the bondpads of the semiconductor device. In such a LOC configuration, thecontinuous strip of leadframes to which the adhesively coated tape is tobe applied at die sites thereon is moved perpendicularly to thedirection of feeding of the continuous roll of tape from which the tapeis cut and applied to the die sites of the leadframe. In such aninstance, a single punch is typically used to cut the tape from thecontinuous roll of tape and apply the cut tape to the die site of anindividual leadframe in a one-punch operation where the tape is fedorthogonally with respect to the feeding and movement of the leadframes.The leads of the die site of the leadframe to which tape is applied bythe punch are, in turn, positioned such that the tape segments arelocated adjacent each other on the leads of the leadframe at the diesite, such leads extending orthogonally on the leadframe with respect tothe movement of the leadframe through the punch assembly.

Such a process suffers from the problem that LOC tape is an expensivematerial and a large amount of tape is wasted during formation of theLOC tape pieces. With a conventional LOC tape punching apparatus asdescribed hereinbefore, the width of the tape must be large enough topunch two pieces of tape with a space therebetween for the bond pads ofthe semiconductor device. Therefore, typically, the pieces of tape arecut from the center of a continuous length of tape having a width thatis larger than required for the individual pieces of tape. Additionally,the tape cut out for the area where the bond pads of the semiconductordevice are located is also waste. In some prior art systems, as much asseventy-five percent (75%) of the tape may be wasted in the cutting andapplication of pieces of tape to a leadframe, such as a LOC leadframe.

Since adhesive tape used for the LOC type semiconductor device assembly,or any leadframe design which requires the use of tape thereon, isrelatively expensive and the misapplication of the tape during themanufacturing process can produce problems in the subsequent automatedmanufacturing processes, in turn, imposing increased costs, a method forefficiently applying adhesive tape where desired on a leadframe isdesirable. Particularly, it is desirable to have tape applied to aleadframe without wasting tape and without having to apply the tape in asingle punch operation to the desired die site of the leadframe.

SUMMARY OF THE INVENTION

A system and method for applying adhesively coated tape material to thedie sites of semiconductor leadframes where the die site of theleadframe is indexed to separate locations for the application of eachtape segment, i.e., decal. The system and method are used to apply tapesegments to leadframes having leads to which the tape segments areapplied which are, in turn, parallel to the direction of movement of theleadframe through the tape die assembly, although, if desired, the leadson the leadframe may extend orthogonally with respect to the directionof movement of the leadframe and the tape segments to be appliedthereto.

A system for applying adhesively coated tape material to the die sitesof semiconductor leadframes includes a first source for supplying afirst length of adhesively coated tape material to a first location of adie site of the leadframe and a second source for supplying a secondlength of adhesively coated tape material to a second location at thedie site of the leadframe after the indexing of the die site of theleadframe to another location for the application of tape thereto.Indexing means are also provided to supply and index for the applicationof tape to a die site of a plurality of leadframes for semiconductordevices in die site by die site of a leadframe-by-leadframe sequence. An“application means” is configured to receive the plurality of leadframesfor semiconductor devices in a die site by die site of aleadframe-by-leadframe sequence and to receive the first length and thesecond length of adhesively coated tape materials, supplied in stripform. The application means has cutting means for independently cuttinga first increment from the first length of adhesively coated tapematerial and applying the first increment to a first portion of a diesite of a leadframe of the plurality of leadframes, supplied in stripform. The cutting means of the application means also independently cutsa second increment of the second length of adhesively coated tapematerial and applies the second increment to a second portion of the diesite of a leadframe of the plurality of leadframes. Control means areinterconnected to the application means, to the indexing means, to thefirst source and to the second source, all supplying operation signalsto the control means.

The operation signals operate the indexing means to supply a pluralityof leadframes for semiconductor devices in leadframe-by-leadframesequence to the application means and to position the first portion ofthe die site and the second portion of the die site to receive the firstincrement and the second increment of adhesively coated tape material,respectively. The operation signals are also supplied to operate thefirst source to cause the first length of adhesively coated tapematerial to be selectively supplied to the application means when or asthe first site is positioned to receive the first increment at the firstportion thereof. The operation signals are also provided to operate thesecond source to cause the second length of adhesively coated tapematerial to be supplied to the application means when or as the secondportion of the first die site is positioned to receive the secondincrement. The control means also supplies operation signals to operatethe cutting means of the application means to selectively cut and applythe first increment to the first portion of the die site of a leadframeof the plurality of leadframes and to cut and apply the second incrementto the second portion of the die site of a leadframe of the plurality ofleadframes.

In the preferred arrangement, the cutting means includes a first diemovable relative to a first cutting structure configured to receive thefirst length of the adhesively coated tape material. The cutting meansalso includes operation means positioned to independently move the firstdie relative to the first cutting structure to form the first incrementand to urge the first increment toward and against the first portion ofthe die site of a leadframe of a plurality of leadframes. The cuttingmeans also preferably includes a second die independently movablerelative to the second cutting structure configured to receive thesecond length of adhesively coated tape material. The operation means ispreferably positioned to move the second die relative to the secondcutting structure to form the second increment and to urge the secondincrement toward and against the second portion of the die site of aleadframe of the plurality of leadframes.

Desirably, the first source includes a first adhesively coated tapesupply configured to supply the first length and first driving meanspositioned to receive the first length and to urge the first lengthtowards the first cutting structure. The first driving means isconnected to the control means to receive operation signals to urge thefirst length toward the first cutting structure only when a firstportion of the die site of a leadframe of the plurality of leadframes ispositioned or is to be positioned relative to the first portion of thedie site to receive the first increment.

The second source preferably includes a second adhesively coated tapesupply configured to supply the second length and second driving meanspositioned to receive the second length. Second driving means alsooperates to urge the second length toward the second cutting structure.The second driving means is connected to the control means to receiveoperation signals to urge the second length toward the second cuttingstructure only when a second portion of the die site of a leadframe ofsaid plurality of leadframes is positioned or is to be positionedrelative to the second die to receive the second increment.

Preferably, the first driving means is a first stepping motor connectedto a first drive roller over which the first length of adhesively coatedtape material is positioned. The first driving means may also include afirst driven roller positioned proximate the first drive roller with thefirst length of adhesively coated tape material positioned between thefirst drive roller and the first driven roller. Similarly and desirably,the second driving means includes a second stepping motor connected to asecond drive roller with a second driven roller positioned proximate thesecond drive roller. The second length of adhesively coated tapematerial is positioned between the second driven roller and the seconddrive roller.

In preferred configurations, the first driving means and the seconddriving means both include guide structure to guide the first lengthbetween the supply of adhesively coated tape material and the firstcutting structure.

The indexing means preferably includes structure configured to urge theplurality of leadframes in strip form for semiconductor devices inleadframe-by-leadframe sequence relative to the application means. Theplurality of leadframes is connected one to the other in a continuousstrip form. The indexing means preferably includes a movable memberwhich engages at least one indexing hole of at least one rail of theleadframe strip to move the leadframe the desired distance for theapplication of the adhesively coated tape material. The indexing meansalternately includes a roller with a motor connected to drive theroller. The motor is connected to the control means to receive operationsignals therefrom to cause the motor to move the plurality of leadframesrelative to the application means in the leadframe-by-leadframesequence. The plurality of leadframes preferably is formed in acontinuous strip form having removable carrier rails or edges thereonhaving, in turn, drive perforations formed therein. The roller desirablyincludes a plurality of teeth positioned to drivingly engage a portionof the drive perforations to thereby connect to and drive the pluralityof leadframes.

The operation means of the cutting means preferably includes a first diemoving mechanism. The first die moving mechanism may be a solenoidmechanism positioned to urge the first die frame to move. The solenoidis connected to receive operation signals from the control means tocause the first die moving mechanism to move the first die toward aleadframe of a plurality of leadframes.

The application means preferably includes a block positioned oppositethe first die with a leadframe of the plurality of leadframes positionedbetween the block and the first die. The block inhibits movement of theleadframe of the plurality of leadframes upon movement of the first dieagainst the leadframe of a plurality of leadframes. The block ispreferably sized for positioning opposite both the first die and thesecond die with a leadframe of the plurality of leadframes positionedbetween the block and the first die and with a leadframe of theplurality of leadframes positioned between the block and the second die.The block desirably includes heat means to heat the block and, in turn,the leadframe, the first increment and the second increment upon urgingof the first increment and the second increment against a leadframe ofthe plurality of leadframes.

The application means also may include guide structure for guiding thefirst length of adhesively coated tape material and guide structure forguiding the second length of adhesively coated tape material. The firstcutting structure and the second cutting structure may be unitarilyformed into a single structure. The operation means may be desirablyconfigured to urge the first die and the second die together.Alternately, the operation means may be configured to urge the first dieand the second die to move independent of each other.

In a desired alternate arrangement, the plurality of leadframes includesa first leadframe, a middle leadframe and a last leadframe. The indexingmeans is operable to urge the first leadframe to a first position withits first site positioned relative to the first die to receive the firstincrement upon activation of the first source with the second sitepositioned spaced to not be contacted by the second die. Control meansis configured to send operation signals to activate the first source tosupply the first length of adhesively coated tape material to the firstcutting means and to send operation signals to not activate the secondsource.

Desirably, the indexing means is also operable to urge the middleleadframe to have its first site positioned relative to the first die toreceive the first increment upon activation of the first source and thefirst die to thereafter urge the middle leadframe to have its secondsite positioned relative to the second die to receive the secondincrement upon activation of the second source and the second die. Thecontrol means preferably sends operation signals to activate the firstsource to supply the first length of adhesively coated tape material tothe first cutting means and to activate the second source to supply thesecond length of adhesively coated tape material to the second cuttingmeans.

Most desirably, the indexing means is operable to urge the lastleadframe to be positioned with its second site positioned relative tothe second die to receive the second increment upon activation of thesecond source and the second die. The first site is positioned to not becontacted by the first die. The operation means desirably sendsoperation signals (e.g., no signals) to activate the second source tosupply the second length to the second cutting means and to not activatethe first source. Preferably, the indexing means urges the firstleadframe and the middle leadframe and the last leadframe to movecontinuously in sequence while simultaneously causing the first sourceand the second source to operate to supply the respective first lengthand the second length to the first cutting means and the second cuttingmeans.

In an alternate arrangement, a system to apply adhesively coated tape toa LOC leadframe of a plurality of LOC leadframes includes a base and ablock positioned opposite the base and spaced therefrom for a LOCleadframe to pass closely and freely therebetween. Supply means ispositioned relative to the base to supply the first adhesively coatedtape length and the second adhesively coated tape length. Indexing meansare provided to move each LOC leadframe of the plurality of leadframesrelative to the base. Application means is mechanically associated withthe base for cutting the first tape length into a first tape decal andapplying the first tape decal to a first position at a die site of theLOC leadframe. The application means also cuts the second tape lengthinto a second tape decal and applies the second decal to a secondposition of the die site of the LOC leadframe. Control means areinterconnected to the supply means, to the application means and to theindexing means to supply control signals so that decals are applied tothe first position of a die site on a LOC leadframe and so that decalsare applied to the second position of a die site on a LOC leadframe.

A method of attaching decals includes providing the first source, thesecond source, indexing means and application means. The method includesoperating the first source to supply a length of first adhesively coatedtape to the application means. The second source is also operated tosupply a length of adhesively coated tape to the application means. Theapplication means operates to cut the first decal from the first lengthof the first adhesively coated tape and applies the first decal to thefirst position of a die site of each LOC leadframe.

The application means includes a first die for cutting the first decaland a second die for cutting the second decal. The indexing meansoperates to advance the first LOC leadframe of the plurality ofleadframes to position its first site to receive the first decal, toindex the first leadframe to position its second position of a die siteto receive the second decal, and to concurrently index a second LOCleadframe of the plurality of LOC leadframes to position the first siteof the second LOC leadframe on the plurality of LOC leadframes toreceive another first decal at the same time the first LOC leadframe isto receive the second decal.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a simplified depiction of a system of the present invention;

FIG. 2 is a side view of an alternate configuration of the system of thepresent invention;

FIGS. 3 and 4 both together are an exploded view of an applicationmechanism of the present invention;

FIG. 5 is a simplified cross-sectional side view of a portion of theapplication structure of FIGS. 3 and 4;

FIG. 6 is a simplified depiction of the top portions of applicationstructures of the present invention;

FIG. 7 is an exploded perspective rendition of drive structure forurging adhesive tape toward the application structure of the presentinvention;

FIGS. 8 through 11 show several components of the driving structure ofFIG. 7;

FIG. 12 is a partial cross-sectional side view of a portion of thestructure of FIG. 10;

FIGS. 13 and 14 are illustrations of alternate configurations of a drivestructure of the present invention;

FIGS. 15 and 17 depict portions of an alternate configuration of a drivestructure of the present invention in perspective;

FIG. 16 is a simplified illustration of an alternate configuration ofthe present invention; and

FIG. 18 is a simplified flow diagram of a method of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to drawing FIG. 1, a system 10 is illustrated for applying aplurality of decals or adhesive tape increments to portions of a diesite of each leadframe of a plurality of leadframes for use withsemiconductor devices moving the leadframe in leadframe-by-leadframesequence through the application structure to individually apply eachadhesive tape increment to a portion of each die site of each leadframeat a separate indexed location of the die site of the leadframe.

More specifically, the system 10 of FIG. 1 includes a first source 12for supplying a first length 14 of adhesive material. The system 10 alsoincludes a second source 16 for supplying a second length 18 of adhesivematerial. The system 10 also has indexing means which here includesindexing structure 20. The die sites of a plurality of leadframes 22-26is positioned to be moved relative to application structure 30 by theindexing structure 20. The application structure 30 is configured toreceive the plurality of leadframes 22-26 of semiconductor devices aswell as to receive the first length 14 of adhesive material and thesecond length 18 of adhesive material. As will be discussed hereinafter,the application means includes cutting means for cutting a firstincrement from the first length 14 of adhesive material and applying thefirst increment to a first portion of a die site (e.g., site 90) of anindividual leadframe of the plurality of leadframes 22-26 and forcutting a second increment from the second length 18 of adhesivematerial and applying the second increment to a second portion of thedie site (e.g., site 96) of an individual leadframe of the plurality ofleadframes 22-26 at a second location thereof.

Control means is also provided to provide control signals or operationsignals to operate the system. The control means here shown includes acontroller 32 interconnected to operate the indexing means and, moreparticularly, the indexing structure 20. It is also interconnected tothe first source 12 and to the second source 16 to respectively supplythe first length 14 and the second length 18 to the application meansand, more particularly, the application structure 30. The controller 32supplies operation signals to operate the cutting means of theapplication means to selectively cut and supply the first increment ofthe first length 14 to the first portion of a die site of a leadframe ofthe plurality of leadframes 22-26 and to selectively cut and apply thesecond increment from the second length 18 to the second portion of adie site of a leadframe of the plurality of leadframes 22-26.

The first source 12 illustrated in drawing FIG. 1 includes a firstadhesive supply 34 configured to supply the first length 14. The firstsource 12 also includes a first driving means such as first drivestructure 36 configured to receive the first length 14 and to urge thefirst length 14 toward the application structure 30 and morespecifically the first cutting structure of the application structure30. The first adhesive supply 34 includes a roll of adhesively coatedtape material 35 wound on or associated with reel 38. The reel 38 isrotatably mounted to rotate with or about axle 40. The axle 40 is eitherfixedly or rotatably mounted to other supporting structure not hereshown. The adhesively coated tape material 35 is shown passing through,over or about a first guide 42 which is fixedly or rotatably mountedabout a second axle 44. The second axle 44 is either fixedly orrotatably mounted to other support structure not here illustrated. Thefirst guide 42 is positioned to align the first length 14 to the firstdrive structure 36.

The first drive structure 36 here shown includes a drive roller 46interconnected to be driven by a first drive shaft 48 and a firststepping motor 50. The stepping motor 50 is interconnected by aconductor 52 to receive operating signals from the controller 32. Thatis, electrical signals are supplied via conductor 52 to activate thestepping motor 50 to, in turn, drive the roller 46 and the first length14 toward the application structure 30.

As also seen in drawing FIG. 1, the second source 16 includes a secondsupply of adhesively coated tape material 54 associated with a reel 56on axle 40. The second adhesive supply 54 includes a circular roll ofadhesively coated tape material 55 that passes through, over or about asecond guide 58 which is also rotatably or fixedly mounted about theaxle 44. The second length 18 proceeds from the second adhesive supply54 to the second drive structure 60.

As here shown, the second drive structure 60 includes second driveroller 62 which is driven by a second stepping motor 64 via a seconddrive shaft 66. The second stepping motor 64 is interconnected byconductor 68 to receive electrical drive signals from the controller 32.That is, upon receipt of an electrical signal, the stepping motor 64rotates, in turn, causing the drive shaft 66 and the second drive roller62 to rotate to urge the second length 18 toward the applicationstructure 30 and, more particularly, the second cutting structure apreselected distance which preferably is the length of the increment ordecal.

Also depicted in drawing FIG. 1, the indexing structure 20 includes amovable arm 70′ (shown in dashed lines) which engages an indexing hole82 in the rail or edge 80 to move the strip of leadframes a desiredamount or distance. The movable arm 70′ may be actuated in anyconvenient manner using any suitable power source and centralarrangement. Alternately, the indexing structure 20 includes an indexingroller 70 interconnected by a shaft 72 to a drive motor 74. The drivemotor 74 is interconnected by conductor 76 to receive operation signalsfrom the controller 32. The operation signals cause the motor 74 torotate which, in turn, causes the indexing roller 70 to rotate. Theplurality of leadframes for semiconductor devices is positioned to bedriven by the indexing roller 70 to, in turn, cause the plurality ofleadframes 22-26 to move relative to the application structure 30. Itmay be particularly noted that the plurality of leadframes 22-26 ofsemiconductor frames is formed to have a removable carrier rail or edge78 and 80 on each side. Each removable edge or rail 78 and 80 has aplurality of perforations positioned to interact with a plurality ofteeth 84 and 86 in or on the indexing roller. That is, the teeth 84 and86 are positioned to drivingly engage the indexing holes 82 tofacilitate movement of the plurality of leadframes 22-26 relative to theapplication structure 30. Upon completion of certain steps in themanufacturing process, the removable carrier rails or edges 78 and 80may be removed from the leadframes 22-26. Further, the leadframes arehere shown to be joined to each other in a continuous strip form. In themanufacturing process subsequent to that herein illustrated anddiscussed, adjacent leadframes such as leadframes 22 and 23, forexample, are also separated one from the other for further processing.

The application means may include a block 88 positioned above theapplication structure 30. As hereinbefore noted, each leadframe, such asleadframe 23, has a first portion 90 of a die site to receive a firstincrement of the first length 14. The first increment may also bereferred to as a decal. The first increment or decal is urged upward bya die through a first die aperture 92 in the application structure 30.Similarly, a second increment or decal is urged upwardly by a second diethrough a second die aperture 94 to position the second decal orincrement at a second site such as second portion 96 of a die site. Asthe leadframes 22-26 move 98 by operation of the indexing structure 20,the first portion 90 of a die site is positioned relative to the firstdie aperture 92. Activation of the application structure 30 by thecontroller 32 causes the application structure to apply the firstincrement or first decal through the first die aperture 92 to aleadframe and, more particularly, to the first portion 90 of a die siteof a leadframe such as leadframe 23 of the plurality of leadframes.Similarly, on positioning of the second portion 96 of a die siterelative to the second die aperture 94, the controller 32 causes theapplication structure 30 to operate and, in turn, apply the secondincrement or second decal through the second die aperture 94 to thesecond portion 96 of a die site of a leadframe such as leadframe 23 ofthe plurality of leadframes 22-26.

In operation, the first leadframe, such as leadframe 23, is indexed toposition the first portion 90 of a die site relative to the first dieaperture 92. In turn, the controller 32 activates the stepping motor 50via conductor 52 to, in turn, operate the drive roller 46 of the firstdrive structure 36. In turn, the first length 14 is urged toward theapplication structure 30 so that the first increment or first decal canthereby be formed by the application structure as more fully discussedhereinafter. With the first portion 90 of a die site of the leadframe 23positioned relative to the first die aperture, and with no secondportion of a die site, such as of leadframe 24, positioned relative tothe second die aperture 94, the controller 32 does not activate thesecond stepping motor 64. In turn, the second length 18 is not urgedtoward the application structure 30. In turn, the second increment ordecal is not formed and is not urged upward through the second dieaperture 94. A savings in adhesively coated tape material is therebyrealized. Further, adhesively coated tape material 55 is not appliedupward against the block 88 and does not build up over time to interferewith the quality and operation of the system 10. That is, the adhesivelycoated tape material can build up and interfere with the smoothoperation of the system and to potentially interfere with the quality ofa particular leadframe of the plurality of leadframes.

The controller 32 here illustrated may be any combination of electronicand electromechanical devices having an input structure, to receiveinput data pertaining to the desired speed as well as the length of theincrements and the size (e.g., length) of the leadframes. Preferably, acomputing structure is positioned therewith to generate signals to, inturn, cause electromechanical devices to supply electrical energy via aplurality of relays and conductors. The electrical energy is receivedfrom the conventional sources of electrical energy via a conductor 100.A plurality of relays or the equivalent thereof in the controller 32 isactivated to supply electrical energy via conductors 68 and 52 to theirrespective stepping motors 64 and 50, as well as to activate theapplication structure 30, all to form and apply the first increment andthe second increment from the first length 14 and the second length 18of the adhesively coated tape materials 35 and 55. Similarly, relays ortheir equivalent are activated to supply signals via conductor 76 to, inturn, cause the motor 74 to index and to drive the plurality ofleadframes 22-26 relative to the application structure 30.

Although the controller 32 may be configured to operate the block 88,the block 88 may be separately powered from an external source viaconductor 102. The block 88 is heated to, in turn, heat the adhesivecoating on the first length of tape 14 and the second length of tape 18so that the adhesive will, in turn, adhere to each leadframe of theplurality of leadframes 22-26.

Referring now to drawing FIG. 2, a system 104 similar to system 10includes a source of adhesively coated tape material 106 along withapplication structure 108. The source of material 106 includes a firstroll of adhesively coated tape material, not illustrated, as well as asecond roll 110 of adhesively coated tape material positioned to berotatably dispensed from reel 112. The reel 112 rotates freely about anaxle 114 to form a second length 116. The second length 116 and a firstlength (not shown) pass about first guide structure 118 that includesrollers similar to the first guide 42 and second guide 58 shown in FIG.1. The second length 116 and the first length (not shown) pass into thedriving structure 120 that includes a first drive roller 122 and asecond drive roller 124. A first driven roller (not shown) and the firstdrive roller (not shown) have the first length (not shown) passingtherebetween. A second drive roller 124 and a first drive roller 122 areshown with the second length 116 passing therebetween. A dotted line 126represents an axle connection between the second drive roller 122 and asecond stepping motor 128. The second stepping motor 128 is connected byconductor 130 to a controller (not here shown) similar to controller 32.The first length from the first source (not shown) is similarly drivenby a first stepping motor (not shown).

As here shown, the application structure 108 includes a base 132 whichis positioned spaced apart a distance 136 from a block 134 similar toblock 88. The distance 136 is exaggerated in FIG. 2 to facilitateillustration and is selected to provide for passage of a plurality ofleadframes 138 while providing an anvil or backing for a first die 140and a second die 142.

As illustrated in drawing FIG. 2, the first die 140 and the second die142 pass upward through the base 132 and other structure to cut andapply respectively a first increment of the first length and a secondincrement of the second length 116 to each portion of a die site of aleadframe of a plurality of leadframes 138. As here shown, the first die140 and the second die 142 are urged upwardly by die plate 144. The dieplate 144 passes over bushings such as bushings 146 and 148 and througha shoe 150. A solenoid 152 is positioned to urge the die plate 144upward in order to urge the first die 140 and the second die 142 upwardagainst a leadframe of the plurality of leadframes 138. If desired, thedie plate 144 may comprise two or more independently actuated dieplates, each being actuated by its own separate solenoid 152 fromindependent signals from the controller 32.

Turning now to drawing FIGS. 3 and 4, an application structure is shownin an exploded perspective format. As can be seen from the bottom ofdrawing FIG. 3 and the top of drawing FIG. 4, the components illustratedin drawing FIG. 4 interconnect with the structure at the bottom ofdrawing FIG. 3, all as more fully discussed hereinafter. The applicationstructure illustrated in drawing FIGS. 3 and 4 is suitable for use asthe application structure 30 illustrated in drawing FIG. 1 and theapplication structure 108 illustrated in drawing FIG. 2.

As illustrated in drawing FIG. 3, a base 160 is shown formed to begenerally rectilinear in shape as illustrated. It has a left side 162spaced apart from a right side 164. A front cross member 166 and therear cross member 168 extend between and space the left side member 162from the right side member 164. The left side member 162, the right sidemember 164, the front cross member 166 and the rear cross member 168 arearranged in a rectilinear fashion as shown to define an opening orvolume 170.

The front cross member 166 has a front lip 172 and the rear cross memberhas a rear lip 174, both of which are provided for attachment toexternal supporting structure.

A punch guide insert 176 is formed with a central portion dimensioned tosnugly and slidably fit within the opening 170. A forward portion 180and a rear portion 182 are sized to snugly fit between the left side 162and the right side 164 of the base 160. More specifically, the left side162 and the right side 164 are spaced apart a distance 184 and, in turn,define a front notch 186 and a rear notch 188. The forward portion 180is sized in width 190 to be substantially the distance 184 to, in turn,facilitate a snug relationship when the forward portion 180 ispositioned in the front notch 186. Of course, the rear portion 182similarly fits snugly in the rear notch 188.

Upon positioning of the punch guide insert 176 with the center portion178 in the opening 170, and the forward portion 180 in the front notch186 and the rear portion 182 in the rear notch 188, it can be seen thatapertures 192-195 formed in the punch guide insert 176 align withcorresponding apertures 196-199 formed in the base 160 and, moreparticularly, in the front cross member 166 and the rear cross member168. Appropriate fasteners, such as screws, may be used to fasten thepunch guide insert 176 to the base 160.

The punch guide insert 176 has a left tape guide 200 and a right tapeguide 202. It can be seen that the left tape guide 200 and the righttape guide 202 are both C-shaped in cross section, providing lower leftflat surface 204 and lower right flat surface 206, respectively. It canbe seen that the left tape guide 200 has a width 208 which is sized tobe comparable to the width 210 of a first length 212 of adhesivelycoated tape material which is comparable to the first length 14 shown inFIG. 1. Thus, the first length 212 of adhesively coated tape materialcan move in and be guided and aligned by the left tape guide 200 as thefirst length moves toward a first die aperture 214 which is similar tothe first die aperture 92 shown in drawing FIG. 1. Notably, the leftflat surface 204 is planar or substantially level and fabricated of ametal material that will minimize the amount of friction between theleft flat surface 204 and the first length 212. It may also be notedthat the left tape guide 200 has a left side wall 216 and a right sidewall 218 in order to provide lateral support for the first length 212and, more particularly, to guide the first length 212 as it moves towardthe first die aperture 214. The left tape guide 200 provides formovement of the first length 212 in a direction 220. In otherconfigurations, the left tape guide 200 may provide for movement of afirst adhesively coated tape material opposite to direction 220.

It can also be seen that the right tape guide 202 is formed to besimilar in configuration to the left tape guide 200. More specifically,the right tape guide 202 has a left side wall 224 and a right side wall226. The width 228 of the right tape guide 202 is selected to providefor a snug but slidable fit of the second length 230. More particularly,the width 228 of the right tape guide 202 is selected to besubstantially the same as, but slightly more than, the width 232 of thesecond length 230. Similarly, the right tape guide 202 extends along thefull length 234 of the punch guide insert 176 so that a second length,such as second length 230, may move in a direction 236 from the forwardportion 180 to the rear portion 182 as shown or in a direction oppositeto direction 236.

As can be seen in drawing FIG. 3, the second length 230 is sized to movefrom the forward portion 180 through the right tape guide 202 toward thesecond die aperture 238. The right flat surface 206 is flat or planar,similar to the left flat surface 204.

The punch guide insert 176 may be fabricated from any material suitablefor movement of the first length 212 and the second length 230. An ASSTsteel has been found to be suitable; but any other similar steel alloysthat provide for a low friction relationship between the adhesivelycoated tape material and, more particularly, the second length 230 andthe right flat surface 206 is desired.

It should also be noted that the width 208 of the left tape guide andthe width 228 of the right tape guide may be substantially identical.Alternatively, the width 208 and the width 228 may vary in order toaccommodate tape material of different widths which may be selected asdesired by the user.

As further seen in drawing FIG. 3, a tape lead-in guide 240 is shown tobe connectable through an aperture 242 by a screw (not shown)interconnecting to a corresponding aperture 244 formed in the forwardportion 180 of the punch guide insert 176. The tape lead-in guide 240has a left channel insert 246 which has a width 248 selected to snuglyfit within the left tape guide 200. The left channel insert 246 extendsdownwardly a distance 250 from the undersurface 252 of the tape lead-inguide 240. The distance 250 is selected to provide an upper guidesurface for the first length 212. Similarly, a right channel insert 254is sized to extend downwardly a distance 255 and width 253 to snugly fitwithin the right tape guide 202 to provide an upward guide surface forthe second length 230. The tape lead-in guide 240 is sized in length 256a distance selected to provide for a left channel insert 246 and a rightchannel insert 254 of sufficient length 256 to stably guide the firstlength 212 and the second length 230.

As illustrated in drawing FIG. 3, a cutter block 258 is shown having aleft recess portion 260 sized in length 262 a distance so that uponinstallation, the rear edge 264 is positioned proximate the front edge266 of the first die aperture 214 in the punch guide insert 176.Therefore, a die (e.g., die 142 illustrated in drawing FIG. 2) passingupwardly through the first die aperture 214 will urge the first length212 upwardly past the rear edge 264 to, in turn, cause an increment ordecal of the first length 212 to be formed and to be urged upwardlytoward a portion of a die site of a leadframe of a plurality ofleadframes.

Similarly, the right portion 268 of the cutter block 258 is sized inlength 270 so that, when installed, the rear edge 272 is positionedproximate the front edge 274 of the second die aperture 238. Therefore,the second length 230, upon positioning over the second die aperture238, can be formed into a second increment as it is urged past the rearedge 272 of the right portion 268 to thereby form the second incrementor decal which is, in turn, urged upward toward a portion of a die siteof a leadframe of a plurality of leadframes. It should be understoodthat the use of the word “second” is intended to infer that it is secondin sequence and to distinguish it from the other or first increment ordecal.

A guide insert 276 is also shown in drawing FIG. 3 having a front edge278 formed to mate with the rear edges 264 and 272 of the cutter block258. Notches 280 and 282 are formed to register with the first dieaperture 214 and the second die aperture 238 so that a die may be urgedupward there past with the first increment of the first length 212 andso that a die may be urged upward there past with the second incrementor second decal of the second length 230.

Apertures 284 and 285 are provided in the cutter block 258 to receivescrews for interconnection with corresponding apertures 286 and 287formed in the punch guide insert 176. Similarly, apertures 288 and 289are formed in the guide insert 276 to receive screws for threadedinterconnection to correspond to the apertures 290 and 292 formed in thepunch guide insert 176.

Four guide posts 294-297 are also shown in drawing FIG. 3. They aresized in cross section to snugly fit within the corresponding apertures298-301 formed in the base 160. Screws, or any other suitable structure,may be provided to snugly secure the posts 294-297 within thecorresponding apertures 298-301. Four bushings 302-305, shown in drawingFIG. 4, are sized with interior apertures 306-309 to snugly and slidablyfit over the guide posts 294-297. The bushings 302-305 also slidably fitthrough corresponding apertures 310-313 formed in a punch shoe 314. Aleft die 316 is also shown in drawing FIG. 4. The left die 316 has awidth 320 and a length 322 selected to snugly fit within the punch shoedie aperture 324 and to correspondingly register with and slide snuglythrough the first die aperture 214 in the punch guide insert 176 shownin drawing FIG. 3. Further, the left die 316 will pass through the notch280 as it proceeds upwardly toward a semiconductor device leadframewhich is passing over the top surface of the application structure,which top surface is comprised of the top surface 241 of the tapelead-in guide 240 and the corresponding top surface 259 of cutter block258 and the top surface 277 of the guide insert 276. That is, the leftdie 316 is sized in height 326 to extend upwardly a distance so that thetop surface 328 contacts the leadframe of a plurality of leadframes ofsemiconductor devices passing over the top surfaces 241, 259 and 277 inorder to adhere a first increment of the first length 212 to a portionof a die site of a leadframe of the plurality of leadframes, such firstsite being selected by positioning a leadframe of each of the pluralityof leadframes in a desired location and by selecting the width 190 ofthe punch guide insert 176 and, more particularly, the distance betweenthe left tape guide 200 and the right tape guide 202.

Now referring back to drawing FIG. 4, the underside 330 of the left die316 rests against a punch plate 332. A solenoid, or other similar deviceto cause upward motion of the punch plate 332, is positioned against theunderside 334 of the punch plate to urge the plate upward and, in turn,urge the bushings 302-305 and the left die 316 and the right die 318upwardly through the punch shoe 314 as more fully discussed hereinafter.The bushings 302-305 extend downward through corresponding apertures336-339 formed in the punch plate 332. The bushings 302-305, as well asthe punch plate 332, the left die 316 and the right die 318, as well asthe punch shoe 314, are all held in place by retaining rings 341-343shown in drawing FIG. 3.

Referring back to drawing FIG. 4, the right die 318 has a width 344 anda length 340 selected to register with a corresponding punch shoe rightdie aperture 348 formed in the punch shoe 314. The right die 318 has aheight 350 selected to extend upward through the punch shoe right dieaperture 348 and through the second die aperture 238 formed in the punchguide insert 176 and also through the right notch 282 formed in theguide insert 276 for further travel to affix a second increment or decalformed from the second length 230 of adhesively coated tape material ina preselected second portion of a die site of a leadframe of a pluralityof leadframes.

It may be noted that the left die 316 and the right die 318 are hereshown to be of substantially identical width 320 and 344, respectively,as well as substantially identical lengths 322 and 340, respectively.The left die 316 and the right die 318 also have substantially identicalheights 326 and 350. The lengths 322 and 340, as well as the widths 344and 320, may vary based on the size of the decal or increment desired tobe applied to each leadframe of a plurality of leadframes ofsemiconductor devices.

It may be noted that the distance the left die 316 and the right die 318travel past the surface, defined by the surfaces 241, 259 and 277 (FIG.3), is controlled by the height 352 or length of each of the bushings302-305. It may also be noted that the left die 316 and the right die318 each have a respective shoulder 354 and 356 to preclude driving thedies 316 and 318 through the corresponding punch shoe left die aperture324 and the punch shoe right die aperture 348.

It should be understood that in operation a driving mechanism, such as asolenoid 152 shown in drawing FIG. 2, operates to urge the punch plate332 upward to, in turn, drive the left die 316 and right die 318 upwardthrough the punch shoe 314 and through the first die aperture 214 andthe second die aperture 238. Mechanisms, other than a solenoid, may beused to urge the punch plate upward. For example, a mechanical camstructure may be provided, as well as a hydraulic piston or any othersimilar device which provides vertical or upward force sufficient todrive the left die 316 and the right die 318. It may be noted that thetotal travel of the left die 316 and the right die 318 is such that, ata low point, the tops are slightly below the level of the flat surfaces204 and 206 and at the high point the tops are slightly above what isessentially a flat surface defined by the surfaces 241, 259 and 277(FIG. 3). Thus, the travel was slightly more than the height 257 of theleft recess portion 260 which is sized to receive the cutter block 258and the guide insert 276.

Turning to drawing FIG. 5, a simple side view of an applicationstructure 362, similar to the application structure of drawing FIGS. 3and 4, as well as the application structures 30 and 108, is depicted. Asecond length of adhesively coated tape material 364 from a supply ofadhesively coated tape material extends through the applicationstructure 362 to a second die channel 366. That is, the applicationstructure 362 has a channel 366 sized to snugly and slidably receive asecond die 368 to move past a cutter block 370 and a corresponding guideinsert 372 comparable to the cutter block 358 and the punch guide insert176 of drawing FIG. 3.

Similarly, a first die 374 is shown positioned in a first die channel376 for snug but slidable movement therein. A first length of adhesivelycoated tape material from a first supply of adhesively coated tapematerial extends toward the first die channel 376. The first die movesupward past the cutter block 370 to thereby form a first increment orfirst decal 378. The first die 374 positions and forcibly urges thefirst decal 378 to the underside 380 of a leadframe 382 of a pluralityof leadframes which are passing over upper surface 384 of theapplication structure 362.

The block 386 is comparable to block 134 and block 88 (FIG. 1) and ishere shown spaced away from the upper surface 384 a distance 385 that isexaggerated to facilitate illustration. The block 386 is also shownspaced away from the leadframe 382 an exaggerated distance 387 to showthat the leadframe 382 slidably moves proximate the block 386. Inpractice, the distance 385 and the distance 387 is selected (e.g., 5-10millimeters) so that the leadframes 382 readily move between the block386 and the surface 384. At the same time, the distances 385 and 387 areselected so the block 386 functions as an anvil without appreciablydistorting, deflecting or bending the leadframe 382.

Dies 374 and 368, illustrated in drawing FIG. 5, are shown in an upwardposition respectively, the first increment or decal 378 as well as acorresponding second decal or second increment 388. That is, the seconddie 368 moves upward, urging the adhesively coated tape material of thefirst increment 378 past the cutter block 370 to, in turn, form thesecond decal or increment 388 and to further urge the second decal orincrement 388 upward against the underside 380 of the leadframe 382 at asite selected by the dimensioning of the apparatus and by the movementof the leadframe 382 relative to the application structure 362.Similarly, the first die moves upward to form and position the firstdecal or increment 378.

Referring now to drawing FIG. 6, a first plurality of leadframes 390 forsemiconductor devices is shown consisting of leadframes 392-399. Theleadframes are positioned to move toward first application structure 400and, more particularly, over the top surface 402 of the firstapplication structure 400. A second plurality of leadframes 404 hasleadframes 405-412 positioned to move over the top surface 414 of asecond application structure 416. A third application structure 418 isalso shown. Although the first application structure 400, secondapplication structure 416 and the third application structure 418 areall shown in side-by-side relationship, such orientation is strictly forpurposes of illustration.

Referring to the third application structure 418, first tape guide 420is shown having a central axis 422. The top 424 of a first die is shownin its first die channel extending upwardly through a first die notch426 formed in a guide insert 428. Similarly, a second tape guide 430 isshown having a central axis 432. The top 434 of a second die is shownextending upwardly through a second notch 436 in the guide insert 428.The guide insert 428 is positioned proximate a cutter block 438 which,in turn, is adjacent the top surface 440 of a tape lead-in guide 442. Ascan be seen, the central axis 422 of the first tape guide 420 is spacedfrom the central axis 432 of the second tape guide 430 a distance 444which may be said to be one leadframe or one pitch. In the preferredillustrations, the distance 444 in fact is equivalent to the overalllength 446 of each leadframe 392-399 and 405-412 of the respectivepluralities of leadframes 390 and 404. The length 444 may be a pitchwhich is different than the length 446 for those leadframes having morethan two sites for a first increment or decal and/or a second incrementor decal. In typical applications such as that here illustrated, onepitch equals the length 446 of one leadframe.

Referring now to the second application structure 416, it can be seenthat the second plurality of leadframes 404 is positioned with a firstleadframe 405 having its first position of a die site positioned overthe top of the first die or relative to the first die to receive theincrement of the first decal therefrom. With indexing means urging theplurality of leadframes 404 across the face or top surface 448 of thesecond application structure 416, it can be seen that the first site 450moves away from the top of the first die, such as the top of the firstdie 424, so that the second site 452 is positioned over the top of orrelative to the top 454 of the second die. Thus, as shown with respectto the first application structure, a first leadframe 392 has its secondsite 456 positioned over the top 458 of a second die while the second orany middle leadframe 393 has its first site 460 positioned over the top462 of the first die.

In reference to the first plurality of leadframes 390 and the secondplurality of leadframes 404, it can be seen that each has leadframesjoined one to the other. The leadframes have removable edges 464 and 466each formed with notches or apertures 468 and 470 which are used inassociation with indexing means to urge the plurality of leadframes 390and 404 to move relative to the application structures 400 and 416. Itmay also be noted that a last leadframe such as, for example, leadframe394, will proceed over the top surface 402 of the first applicationstructure 400. That is, if the plurality of leadframes 390 is severedalong a line 472, leadframe 394 becomes a last leadframe in which firstsite 474 is positioned relative to the top 462 of the first die, afterwhich its second site 476 is positioned over the top 458 of the seconddie. When the second site 476 is positioned over the top 458 of thesecond die, the top 462 of the first die is exposed and does not have aleadframe or a leadframe with a first site positioned thereover. Thus, afirst increment or decal proceeding upward does not have a site againstwhich it is to be positioned. In the event the first length of thesupply of adhesively coated tape material is advanced over the firstdie, a first increment would be formed and could potentially attach tothe underside of a block such as, for example, block 386. In turn, thepotential for contamination with unused increments is evident.

As hereinafter discussed, the controller 32 sends operation signals todrive structures 36 and 60 (FIG. 1) to advance the first length 14 andthe second length 18 over the tops of their respective dies so that afirst increment or first decal and a second increment or second decalcan thereby be formed and attached at their respective first sites andsecond sites of each of the leadframes of the plurality of leadframeswithout advancing a second increment when the first leadframe is not yetpositioned thereover and not forming and advancing a first incrementwhen the last leadframe is no longer positioned over the top of thefirst die.

Referring now to drawing FIGS. 7 through 11, drive structures suitablefor use as a first drive structure 36 shown in drawing FIG. 1 and asecond drive structure 60 shown in FIG. 2 are depicted in an explodedperspective format. The illustrations of drawing FIGS. 7 through 11 aresomewhat simplified to facilitate understanding.

In drawing FIGS. 7 and 11, a lower roller base 480 is shown with aforward alignment pin 482. The lower roller base 480 has a recess 486formed therein sized to rotatively receive therein a lower right roller488 and a lower left roller 490.

The lower right roller 488 is mounted to a right axle 492 and rotatesindependent of and relative to the lower left roller 490, which itselfis mounted to the left axle 494 to rotate about a common axis 496. Ifthe rollers are fixedly secured to their axles 492 and 494, the axles492 and 494 are joined at a slip joint 499 between the lower left roller490 and lower right roller 488. The respective right axle 492 and leftaxle 494 are positioned in and corresponding to the right lower bearinghalf 498 and the left lower bearing half 500.

In drawing FIGS. 7 and 10, a lower roller top housing 502 is shown witha rear aperture 504 positioned to register with the upwardly extendingrear alignment pin 484 and a front alignment aperture 506 positioned toregister with the forward alignment pin 482. A roller recess 508 isformed in the lower roller top housing 502 to register with and receivethe lower right roller 488 and lower left roller 490. A right upperbearing half 510 and a left upper bearing half 512 is formed to receivethe right axle 492 and the left axle 494, respectively. That is, theright lower bearing half 498 and the right upper bearing half 510together form a bearing to receive and support the right axle 492therewithin. Similarly, the left lower bearing half 500 and the leftupper bearing half 512 together receive the left axle 494 therewithin.

An upper roller base 514 is also shown in drawing FIGS. 7 and 9 with arear alignment aperture 516 positioned to register with the rearalignment pin 484 extending upwardly from the lower roller base 480.Similarly, the upper roller base 514 has a forward alignment aperture518 positioned to register with the forward alignment pin 482 extendingupwardly from the lower roller base 480.

The upper roller base 514 has upper roller recess 520 formed therein toreceive a right upper roller 522 and a left upper roller 524. The rightupper roller 522 and left upper roller 524 are both rotatively mountedabout an axle 526 having a left end 528 and a right end 530. The recess520 has at its left end 532 a pair of tabs 534 and 536 spaced apart toreceive and support the left end 528 of the axle 526. The tabs 534 and536 are spaced apart a distance less than the diameter 544 of the commonaxle 526 at the left end 528. Similarly, at the right end 538 a pair ofspaced tabs 540 and 542 are spaced apart a distance less than thediameter 544 of the common axle 526. Therefore, the left end 528 and theright end 530 of the common axle 526 are rigidly supported in the recess520 to preclude general fore and aft movement upon attachment thereto ofthe upper roller top housing 546.

The upper roller top housing 546 (FIGS. 7 and 8) has a roller recess 548formed therein to rotatively receive therewithin the left upper roller524 and the right upper roller 522. Apertures 550 and 552 are positionedto threadedly receive set screws therethrough to contact thecorresponding right end 530 of the common axle 526 and the left end 528of the common axle 526 to thereby rigidly hold the common axle 526 inplace while providing for free rotation of the right roller 522 and theleft roller 524 thereabout. Notably, the upper roller top housing 546 issecured to the upper roller base 514 through the use of screwsassociated with a plurality of apertures 554-557.

Positioned between the upper roller base 514 and the lower roller tophousing 502 is a tape guide 558. The tape guide has an aperture 560positioned to receive the rear alignment pin 484 in order to align thetape guide 558 relative to the lower right roller 488, lower left roller490, upper right roller 522 and upper left roller 524. It also has aforward alignment aperture to align with the forward alignment pin 482.

The tape guide 558 has a roller recess 564 sized to receive the leftlower roller 490 and right lower roller 488 therein to extend justbarely above the top surface 566 of the tape guide 558. The lower leftroller 490 and lower right roller 488 will contact the first length ofadhesive tape supplied from the source of adhesive tape along a righttape track 570, a left tape track 568 and a second source for a secondlength of adhesive tape supplied from a second source along a right tapetrack 570. The left tape track 568 and the right tape track 570 areformed of material to provide for reduced friction so that the firstlength and the second length of adhesive tape may slide smoothlythereover. The left tape track 568 and the right tape track 570 may beslightly recessed to guide the left length and the right length andinhibit lateral movement thereof.

It may be noted that the left roller 490 and the right roller 488 extendupwardly through the roller recess 508 and the roller recess 564 todrivingly engage respectively the first length of adhesive tape and thesecond length of adhesive tape. The right upper roller 522 is positionedas a driven or idler roller with the second length passing between thedriven upper right roller 522 and the driving right lower roller 488.Similarly, the left lower roller 490 drives the left upper roller 524with the first length of adhesive tape passing therebetween.

The right axle 492 extends outwardly for inner connection to a steppingmotor or other means for rotating the axle 492 incrementally to advancethe second length a preselected distance to, in turn, provide thedesired length of the second decal or second increment. Similarly, astepping motor or other means is associated with the left axle 494 todrive the left roller 490 to, in turn, advance the first length ofadhesively coated tape material a desired distance or length to providefor the correct dimensions or desired dimension of the first incrementor decal of adhesively coated tape material for application to eachleadframe of a plurality of leadframes.

Referring now to drawing FIG. 12, a forward portion of the tape guide558 is illustrated in partial cross-section. The left tape track 568 isshown recessed a depth 572 that is greater than the thickness of theadhesively coated tape material so that the left tape track 568functions as a guide for the adhesively coated tape material. The righttape track 570 is similarly formed with a depth comparable to depth 572.

At the front end 574 of the tape guide 558, an entry surface 576 isformed at an angle 578 extending downwardly so that the surface 576extends downwardly from the lower flat surface 579 of the left tapetrack 568 and a similar lower flat surface of the right tape track 570(not here shown). It can also be seen in drawing FIG. 7 that the entrysurface 576 extends outwardly at a second angle 580. The right tapetrack 570 extends outwardly at a similar angle. The second angle 580 andthe left tape track 568 are provided to facilitate an entry of therespective first length of adhesively coated tape material and secondlength of adhesively coated tape material into their respective lefttape track 568 and right tape track 570. The rollers 488 and 490 extendinto the recess 564 so they can drivingly engage their respectivelengths of adhesively coated tape material.

Turning now to drawing FIG. 13, a drive structure similar to that shownin drawing FIGS. 7 through 12 is depicted with a first length 582 and asecond length 584 extending over a lower left roller 586 and a lowerright roller 588. Notably, the left axle 590 has a pulley associatedtherewith drivingly interconnected with a stepping motor 594 having adrive pulley 596 associated therewith and with a pulley 600 connectedthereinbetween.

Similarly, the right roller 588 is driven by right axle 602 which, inturn, is driven by a drive pulley 604 connected by a belt 606 to a drivepulley 608. The drive pulley is driven by a stepping motor 610.

In drawing FIG. 14, a similar configuration is shown in which a firstlength 612 is driven by a left pulley 614. The left pulley is connectedby a left axle 616 and is driven by a stepping motor and pulleyconfiguration 617 similar to that illustrated and described with respectto FIG. 13. As can be seen, the right pulley 618 is positioned to drivea second length 620. The right pulley 618 is mounted to a right axle 622and is driven by a pulley and stepping motor arrangement 621 similar tothat illustrated and described in drawing FIG. 13. As can be seen indrawing FIG. 14, the left pulley 614 and the right pulley 618 are eachspaced apart from each other and mounted to a separate left axle 616 andto a separate right axle 622. Other arrangements may be provided inwhich a first length and a second length are separately indexed orstepped toward the application structure.

Turning now to drawing FIG. 15, an alternative punch shoe arrangement isshown in which there is a left punch shoe 630 and a right punch shoe632. Each punch shoe 630 and 632 is mounted to move relative to asimilar plurality of bushings such as bushing 634 which functionssimilar to the bushing illustrated in drawing FIGS. 3 and 4. The leftpunch shoe 630 has a central axis 636 which, along with punch shoe dieaperture 638, is positioned to provide for a sliding relationshiprelative to a die similar to a left die 316. Similarly, the right punchshoe 632 has a central axis 640 passing through the center of thecorresponding apertures 642 and 644 associated with bushings, such asbushing 634, as well as the right punch shoe die aperture 646. In FIG.17, a left punch plate 648 is shown for positioning relative to a leftdie, such as left die 316, and a right punch plate 650 is shown forpositioning relative to a right die, such as right die 318, as betterseen in drawing FIGS. 3 and 4.

As generally depicted in drawing FIG. 16, an application structure 652is positioned relative to a block 654 with a plurality of leadframes forsemiconductor devices 656 moving relative to the application structureby indexing means such as a roller 657 driven by a stepping motor (nothere illustrated). The application structure 652 includes a left punchplate 648 and a right punch plate 650, both positioned to be urgedupwardly by respective solenoids 658 and 660, both activated byconductors 662 and 664. As can be seen, solenoid 658 urges the leftpunch plate 648 upward to, in turn, urge the left die 666 to moveupwardly through the base of the application structure 652 to form andadvance the first increment or decal upward against the underside ofeach frame of the plurality of frames 656 upon orientation of a firstsite relative to the left die 666. Similarly, punch plate 650 may beurged by its solenoid 660 to move upward relative to the plurality offrames 656 to form a second increment from the second length and to urgethe second increment toward and attach it to the underside of a secondsite of a frame positioned relative to the second die 670.

Arrangements, such as that depicted in drawing FIG. 16, may be used witha drive structure in which both the first length and the second lengthare simultaneously advanced. Some adhesively coated tape material willthereby be wasted because the tape will advance to each diesimultaneously with a frame. However, the die will not cut a desiredincrement until such time as the appropriate first site or second siteis presented.

In drawing FIG. 18, a preferred method for operating the illustrated anddescribed apparatus of the present invention is graphically illustratedin a series of steps. More specifically, the preferred method involvesan operating structure comparable to that illustrated in drawing FIGS. 3through 12.

More specifically, it is preferred to separately index or feed the firstlength to the first die. The controller is activated to urge the firstlength to advance a distance sufficient to form the first increment andto urge the first die upward to form and urge the first increment at thefirst site for each and every leadframe of the plurality of leadframes.Similarly, the controller functions to urge the second length toward thesecond die, the desired length sufficient to form the second incrementand only when a second site is presented to or is relative to the seconddie. Thus, the second die and the first die may move simultaneously, buta first decal and a second decal or first increment and second incrementwill be formed only when the first length of adhesively coated tapematerial and the second length of adhesively coated tape material areselectively advanced by the controller. The controller is configured toidentify when a first leadframe is being presented and, moreparticularly, the first site of a first leadframe is being presented tothe first die. The controller may also have means to receive informationto identify how many leadframes of the plurality of leadframes are inexistence and to count those leadframes so that the controller knowswhen to not advance a first length to form a first increment because afirst site is no longer positioned relative to the first die.

Those skilled in the art will recognize that other variations ofstructures and devices may be provided without deviating from theprinciples of the invention as herein set forth and as hereinafterdefined by the claims.

What is claimed is:
 1. A system for applying adhesively coated materialto at least a first portion and a second portion of a semiconductor diemounting site of a first leadframe and second leadframe of a pluralityof leadframes for attachment of a semiconductor device thereto, saidsystem comprising: a first source for supplying a first length ofadhesively coated material at a first location of said at least a firstportion of said semiconductor die mounting site of said first leadframeof said plurality of leadframes; a second source for supplying a secondlength of adhesively coated material at a second location of said atleast a second portion of a semiconductor die mounting site of a secondleadframe of said plurality of leadframes; indexing apparatus including:apparatus for moving said plurality of leadframes relative to saidapplication apparatus in a single leadframe by single leadframe movementof said plurality of leadframes; and application apparatus for receivingsaid plurality of leadframes in a leadframe-by-leadframe sequence, saidplurality of leadframes having a removable portion for engagement by aportion of said application apparatus, said application apparatus forreceiving said first length of adhesively coated material at said firstlocation of said at least a portion of said semiconductor die mountingsite of said first leadframe of said plurality of leadframes and forreceiving said second length of adhesively coated material at saidsecond location of said at least a portion of said semiconductor diemounting site of said second leadframe of said plurality of leadframes,said application apparatus having cutting apparatus for cutting a firstincrement of said first length of adhesively coated material and forapplying said first increment to the first location of said at least afirst portion of said semiconductor die mounting site of said firstleadframe of said plurality of leadframes upon indexing to said firstlocation and for cutting a second increment of said second length ofadhesively coated material and applying said second increment to saidsecond location of said at least a second portion of said semiconductordie mounting site of said second leadframe of said plurality ofleadframes upon indexing to said second location, said applicationapparatus including: a first cutting structure located at the firstlocation having a first cutting die, the first cutting structure forreceiving said first length of said adhesively coated material and forreceiving said first cutting die movable relative to said first cuttingstructure for receiving said first length of said adhesively coatedmaterial; operation apparatus positioned to move said first cutting dierelative to said first cutting structure for forming said firstincrement and for urging said first increment against said firstlocation of said at least a first portion of said semiconductor diemounting site of said first leadframe of said plurality of leadframe; asecond cutting structure located at the second location having a secondcutting die, said second cutting die structure configured for receivingsaid second length of said adhesively coated material and for receivingsaid second cutting die, the second cutting die movable relative to saidsecond cutting structure for receiving said second length of saidadhesively coated material; and operation apparatus positioned to movesaid second cutting die relative to said second cutting structure forforming said second increment and for urging said second incrementagainst said second location of said at least a second portion of saidsemiconductor die mounting site of said first leadframe of saidplurality of leadframe.
 2. The system of claim 1, wherein said firstsource includes: a first adhesively coated material supply for supplyingsaid first length of adhesively coated material.
 3. The system of claim2, wherein said second source includes: a second adhesively coatedmaterial supply for supplying said second length of adhesively coatedmaterial.
 4. The system of claim 1, wherein said application apparatusincludes apparatus for receiving a plurality of leadframes connectedtogether one to another.
 5. The system of claim 4, wherein saidapplication apparatus further includes apparatus for receiving and forpositioning a plurality of leadframes having a removable edge with driveperforations formed therein.
 6. The system of claim 5, furthercomprising a controller in electrical communication with said operationapparatus for sending and receiving operation signals thereto, andwherein said operation apparatus includes: a first die moving mechanismpositioned relative to said first cutting die for moving said firstcutting die toward a leadframe of said plurality of leadframes, saidfirst die moving mechanism being in electrical communication with saidcontroller for receiving said operation signals therefrom to cause saidfirst die moving mechanism to move said first cutting die toward saidleadframe of said plurality of leadframes.
 7. The system of claim 6,wherein said first die moving mechanism includes: a solenoid mechanismpositioned for moving said first cutting die.
 8. The system of claim 1,wherein said application apparatus includes: a block positioned oppositesaid first cutting die with said first leadframe of said plurality ofleadframes positioned between said block and said first cutting die forinhibiting movement of said first leadframe of said plurality ofleadframes upon movement of said first cutting die against said firstleadframe of said plurality of leadframes.
 9. The system of claim 8,wherein said block is sized for positioning opposite both said firstcutting die and said second cutting die having a leadframe of saidplurality of leadframes positioned between said block and said firstcutting die and having a leadframe of said plurality of leadframespositioned between said block and said second cutting die for inhibitingmovement of said plurality of leadframes upon movement of said firstcutting die and said second cutting die against said leadframe of saidplurality of leadframes.
 10. The system of claim 8, wherein said blockincludes: heat apparatus for heating said block, said first incrementcontacting said first leadframe of said plurality of leadframes, andsaid second increment contacting said second leadframe of said pluralityof leadframes.
 11. The system of claim 1, wherein said applicationapparatus includes: a first guide for said first length of adhesivelycoated material and a second guide for said second length of adhesivelycoated material.
 12. The system of claim 1, wherein said first cuttingstructure and said second cutting structure are connected.
 13. Thesystem of claim 1, wherein said operation apparatus is configured forurging said first cutting die and said second cutting die to moveseparately and independently.
 14. The system of claim 6, wherein saidplurality of leadframes includes a first leadframe, a middle leadframeand a last leadframe, and wherein said indexing apparatus includesapparatus for urging said first leadframe to the first location of saidat least a first portion of said semiconductor die mounting site withits first location positioned relative to said semiconductor diemounting site to receive said first increment upon activation of saidfirst source and with its second location positioned to not be contactedby said second cutting die, wherein said controller is in electricalcommunication with said first source and said second source and is forelectrically sending operation signals for activating said first sourceto supply said first length of adhesively coated material to said firstcutting structure and not activating said second source.
 15. The systemof claim 14, wherein said indexing apparatus includes apparatus forurging said middle leadframe to have its first location of said at leasta first portion of said semiconductor die mounting site positionedrelative to said first cutting die for receiving said first incrementupon activation of said first source and said first cutting die andthereafter for urging said middle leadframe to have its second locationof said semiconductor die mounting site positioned relative to saidsecond cutting die for receiving said second increment upon activationof said second source and said second cutting die, and wherein saidcontroller is for electrically sending operation signals for activatingsaid first source to supply said first length of adhesively coatedmaterial to said first cutting structure and for activating said secondsource to supply said second length of adhesively coated material tosaid second cutting structure.
 16. The system of claim 15, wherein saidindexing apparatus further includes apparatus for urging said lastleadframe to be positioned with its second location of saidsemiconductor die mounting site positioned relative to said secondcutting die for receiving said second increment upon activation of saidsecond source and said second cutting die, with its first location ofsaid semiconductor die mounting site positioned to not be contacted bysaid first cutting die, and wherein said controller includes apparatusfor electrically sending operation signals to activate said secondsource to supply said second length of adhesively coated material tosaid second cutting structure and to not activate said first source. 17.The system of claim 16, wherein said indexing apparatus further includesapparatus for urging said first leadframe, said middle leadframe andsaid last leadframe for moving continuously in sequence.
 18. A systemfor applying adhesively coated material to a portion of a semiconductordie mounting site of a leadframe of a plurality of leadframes forsemiconductor devices comprising: a first source for supplying a firstlength of adhesively coated material at a first location of said portionof said semiconductor die mounting site of said leadframe of saidplurality of leadframes; a second source for supplying a second lengthof adhesively coated material at a second location of said portion ofsaid semiconductor die mounting site of said leadframe of said pluralityof leadframes; indexing apparatus for supplying said plurality ofleadframes for semiconductor devices in a leadframe-by-leadframesequence at a first location and a second location of said portion ofsaid semiconductor die mounting site, said indexing apparatus includingapparatus for urging said plurality of leadframes in a desired positionfor application of adhesively coated material; application apparatus forreceiving said plurality of leadframes for semiconductor devices in aleadframe-by-leadframe sequence, for receiving said first length ofadhesively coated material at the first location of said portion of saidsemiconductor die mounting site and for receiving said second length ofadhesively coated material at the second location of said portion ofsaid semiconductor die mounting site, said application apparatus havingcutting apparatus for cutting a first increment of said first length ofadhesively coated material and for applying said first increment to thefirst location of said portion of said semiconductor die mounting siteof said leadframe of said plurality of leadframes and for cutting asecond increment of said second length of adhesively coated material andfor applying said second increment to the second location of saidportion of said semiconductor die mounting site of said leadframe ofsaid plurality of leadframes after the leadframe of said plurality ofleadframes has been subsequently indexed to the second location, saidapplication apparatus including apparatus for receiving a plurality ofleadframes connected together one to another; and control apparatus forelectrical communication with said indexing apparatus and for supplyingoperation signals thereto to supply said plurality of leadframes forsemiconductor devices in said leadframe-by-leadframe sequence to saidapplication apparatus to position the first location of said portion ofsaid semiconductor die mounting site and the second location of saidportion of said semiconductor die mounting site to receive said firstincrement and said second increment, respectively, for operating saidfirst source to cause said first length of adhesively coated material tobe selectively supplied to said application apparatus when the firstlocation of said portion of said semiconductor die mounting site ispositioned to receive said first increment; for operating said secondsource to cause said second length of adhesively coated material to beselectively supplied to said application apparatus when the secondlocation of said portion of said semiconductor die mounting site ispositioned to receive said second increment; and for operating saidcutting apparatus to selectively cut and apply said first increment tothe first location of said portion of said semiconductor die mountingsite of said leadframe of said plurality of leadframes and to cut andapply said second increment to the second location of said portion ofsaid semiconductor die mounting site of said leadframe of said pluralityof leadframes after said leadframe of said plurality of leadframes hasbeen indexed to the second location.
 19. The system of claim 18, whereinsaid cutting apparatus includes: a first cutting structure having afirst cutting die located at the first location, the first cutting diefor movement relative to said first cutting structure for receiving saidfirst length of said adhesively coated material; and operation apparatuspositioned for moving said first cutting die relative to said firstcutting structure for forming said first increment and for urging saidfirst increment toward and against the first location of said portion ofsaid semiconductor die mounting site of said leadframe of said pluralityof leadframes for semiconductor devices.
 20. The system of claim 19,wherein said cutting apparatus further includes: a second cuttingstructure having a second cutting die located at the second location,the second cutting die for movement relative to said second cuttingstructure configured for receiving said second length of said adhesivelycoated material; and wherein said operation apparatus includes apparatusfor moving said second cutting die relative to said second cuttingstructure for forming said second increment and for urging said secondincrement towards and against said second location of said portion ofsaid semiconductor die mounting site of said leadframe of said pluralityof leadframes for semiconductor devices.
 21. The system of claim 20,wherein said first source includes: a first adhesively coated materialsupply for supplying said first length of adhesively coated material.22. The system of claim 21, wherein said second source includes: asecond adhesively coated material supply for supplying said secondlength of adhesively coated material.
 23. The system of claim 22,wherein said indexing apparatus includes: apparatus for urging saidplurality of leadframes for semiconductor devices for movement relativeto said application apparatus.
 24. The system of claim 23, wherein saidapplication apparatus includes apparatus for receiving a plurality ofleadframes connected together one to another.
 25. The system of claim24, wherein said application apparatus further includes apparatus forreceiving and for positioning a plurality of leadframes having aremovable edge with drive perforations formed therein.
 26. The system ofclaim 25, wherein said operation apparatus further includes: a first diemoving mechanism positioned relative to said first cutting die forurging said first cutting die to move toward said leadframe of saidplurality of leadframes, said first die moving mechanism being connectedto said control apparatus for receiving said operation signals therefromto cause said first die moving mechanism to move said first cutting dietoward said leadframe of said plurality of leadframes.
 27. The system ofclaim 26, wherein said first die moving mechanism includes: a solenoidmechanism positioned for urging said first cutting die for movement. 28.The system of claim 27, wherein said application apparatus furtherincludes: a block positioned opposite said first cutting die with saidleadframe of said plurality of leadframes positioned between said blockand said first cutting die for inhibiting movement of said leadframe ofsaid plurality of leadframes upon movement of said first cutting dieagainst said leadframe of said plurality of leadframes.
 29. The systemof claim 28, wherein said block includes apparatus for positioningopposite both said first cutting die and said second cutting die havingsaid leadframe of said plurality of leadframes positioned between saidblock and said first cutting die and having a leadframe of saidplurality of leadframes positioned between said block and said secondcutting die for inhibiting movement of said plurality of leadframes uponmovement of said first cutting die and said second cutting die againstsaid leadframe of said plurality of leadframes.
 30. The system of claim28, wherein said block further includes: heat apparatus for heating saidblock, said first increment, and said second increment upon urging ofsame against said leadframe of said plurality of leadframes.
 31. Thesystem of claim 20, wherein said application apparatus includes: a firstguide for said first length of adhesively coated material and a secondguide for said second length of adhesively coated material.
 32. Thesystem of claim 20, wherein said first cutting structure and said secondcutting structure are connected.
 33. The system of claim 20, whereinsaid operation apparatus includes apparatus for urging said firstcutting die and said second cutting die to move separately andindependently.
 34. The system of claim 29, wherein said applicationapparatus includes apparatus for receiving a plurality of leadframesincluding a first leadframe, a middle leadframe and a last leadframe,and wherein said indexing apparatus includes apparatus for urging saidfirst leadframe to a first position with the first location of saidportion of said semiconductor die mounting site positioned relative tosaid first cutting die for receiving said first increment uponactivation of said first source and having the second location of saidportion of said semiconductor die mounting site positioned to not becontacted by said second cutting die, wherein said control apparatus isfor electrical communication with said first source and said secondsource and for electrically sending operation signals for activatingsaid first source to supply said first length of adhesively coatedmaterial to said first cutting structure and for not activating saidsecond source.
 35. The system of claim 34, wherein said indexingapparatus includes apparatus configured for urging said middle leadframeto have its first location of said portion of said semiconductor diemounting site positioned relative to said first cutting die forreceiving said first increment upon activation of said first source andsaid first cutting die and thereafter for urging said middle leadframeto have its second location of said portion of said semiconductor diemounting site positioned relative to said second cutting die forreceiving said second increment upon activation of said second sourceand said second cutting die, and wherein said control apparatus is forelectrically sending operation signals for activating said first sourcefor supplying said first length of adhesively coated material to saidfirst cutting structure and for activating said second source forsupplying said second length to said second cutting structure.
 36. Thesystem of claim 35, wherein said indexing apparatus further includesapparatus for urging said last leadframe to be positioned with itssecond location of said portion of said semiconductor die mounting sitepositioned relative to said second cutting die for receiving said secondincrement upon activation of said second source and said second cuttingdie and with its first location of said portion of said semiconductordie mounting site positioned for not contacting any portion thereof bysaid first cutting die, and wherein said control apparatus is configuredfor electrically sending operation signals for activating said secondsource to supply said second length of adhesively coated material tosaid second cutting structure and for not activating said first source.37. The system of claim 36, wherein said indexing apparatus furtherincludes apparatus for urging said first leadframe, said middleleadframe and said last leadframe for continuous movement in sequence.38. Apparatus for application of adhesive tape to a semiconductor diemounting site of a LOC leadframe of a plurality of LOC leadframescomprising: a base; a block positioned adjacent said base and spacedtherefrom for said LOC leadframe to pass therebetween, said blockincluding heat apparatus for heating said block and said LOC leadframeand said another LOC leadframe and said first increment and said secondincrement upon urging of same against said LOC leadframe; supplyapparatus positioned relative to said base for supplying a first tapelength at a first location of said semiconductor die mounting site ofsaid LOC leadframe and a second tape length at a second location of saidsemiconductor die mounting site of said LOC leadframe to said base;indexing apparatus for moving said LOC leadframe of said plurality ofLOC leadframes relative to said base from the first location of saidsemiconductor die mounting site to the second location of saidsemiconductor die mounting site, said indexing apparatus includingapparatus for urging said plurality of leadframes in a desired positionfor application of adhesively coated material thereto; applicationapparatus associated with said base for cutting said first tape lengthinto a first tape decal and for applying said first tape decal to thefirst location of said semiconductor die mounting site of said LOCleadframe positioned between said base and said block at the firstlocation and for cutting said second tape length into a second tapedecal and for applying said second tape decal to the second location ofsaid semiconductor die mounting site when said LOC leadframe ispositioned between said base and said block at the second location aftersaid LOC leadframe has been subsequently indexed to the second location,said application apparatus including a plurality of independent cuttingdies for cutting said first and second tape lengths into said first andsecond tape decals; and control apparatus for electrical communicationwith said application apparatus and for sending operation signalsthereto for causing said application apparatus to cut said first tapelength into said first tape decal and for applying said first tape decalto said first location of said semiconductor die mounting site on saidLOC leadframe and to cut said second tape length into said second tapedecal and for applying said second tape decal to said second location ofsaid semiconductor die mounting site on said LOC leadframe positionedbetween said base and said block at the second location.
 39. Theapparatus of claim 38, wherein said application apparatus includes afirst cutting die positioned for cutting said first tape length forforming said first tape decal and for urging said first tape decal tosaid first location of said semiconductor die mounting site, and whereinsaid block is positioned relative to said first cutting die forinhibiting movement of said LOC leadframe of said plurality of LOCleadframes upon movement of said first cutting die against said LOCleadframe of said plurality of LOC leadframes.
 40. The system of claim39, wherein said application apparatus includes a second cutting diepositioned for cutting said second tape length for forming said secondtape decal and for urging said second tape decal to the second locationof said semiconductor die mounting site, and wherein said block is sizedfor positioning opposite both said first cutting die and said secondcutting die with said LOC leadframe of said plurality of LOC leadframespositioned between said block and said first cutting die and withanother LOC leadframe of said plurality of LOC leadframes positionedbetween said block and said second cutting die for inhibiting movementof said another LOC leadframe of said plurality of leadframes uponmovement of said first cutting die and said second cutting die againstsaid LOC leadframe of said plurality of LOC leadframes.
 41. The systemof claim 40, wherein said block includes: heat apparatus for heatingsaid block and said LOC leadframe and said another LOC leadframe andsaid first increment and said second increment upon urging of sameagainst said LOC leadframe.
 42. The system of claim 41, wherein saidapplication apparatus further includes: a first guide for said firsttape length; and a second guide for said second tape length.
 43. Thesystem of claim 42, wherein said indexing apparatus includes structurefor urging said plurality of LOC leadframes to move relative to saidapplication apparatus.
 44. The system of claim 43, wherein saidapplication apparatus further includes: a first die moving mechanismpositioned relative to said first cutting die for urging said firstcutting die to move toward said LOC leadframe of said plurality of LOCleadframes, said first die moving mechanism being electrically connectedto said control apparatus for receiving operation signals therefrom tocause said first die moving mechanism to move said first cutting dietoward said LOC leadframe of said plurality of LOC leadframes.
 45. Thesystem of claim 44, wherein said first die moving mechanism includes asolenoid mechanism positioned for urging said first cutting die formovement.